The Thermodynamic Database for the Development of Modern Lead-Free Solders

A. Kroupa; J. Vízdal

doi:10.4028/www.scientific.net/DDF.263.99

Paper Titles

Interfacial Interaction and Diffusion in Binary Systems
p.75

Collective and Tracer Diffusion via a Defect Cluster in LSGM
p.81

Mechanism and Kinetics of Plasma Nitriding of the Nb-Alloyed PM Tool Steel
p.87

Effect of Fe Addition on Ordering Kinetics in Ni₃Al_1-xFe_x System. Monte Carlo Simulation
p.93

The Thermodynamic Database for the Development of Modern Lead-Free Solders
p.99

Thermodynamic Properties of Liquid Binary Transition-Metal Alloys in the Bretonnet-Silbert Model
p.105

Steam Oxidation Behaviour of Ni-Based Single Crystalline Superalloy for the Advanced Gas Turbine
p.111

The Effect of Oxide Cracks on Hydrogen Ingress in ZrO₂
p.117

Kinetic and Thermodynamic Aspects of High-Temperature Oxidation of Selected Ti-Based Alloys
p.123

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The Thermodynamic Database for the Development of Modern Lead-Free Solders

Abstract:

The methods for the modeling of thermodynamic properties of multicomponent systems are described here. The rules for the creation of a consistent database for multicomponent systems are described generally and documented on the Thermodynamic Database for Lead-free Solders developed in the scope of COST 531 Action. The reassessment of the Sb-Sn system is shown as an example, illustrating the application of consistency rules.

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Periodical:

Defect and Diffusion Forum (Volume 263)

Pages:

99-104

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.263.99

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Online since:

March 2007

Authors:

A. Kroupa, J. Vízdal

Keywords:

Lead-Free Solder, Phase Diagram, Sb-Sn System, Thermodynamic

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References

[1] N. Saunders and A.P. Miodownik: CALPHAD (A Comprehensive Guide, Elsevier, London, 1998).

Google Scholar

[2] B. Sundman and J. Ågren: J. Phys. Chem. Solids Vol. 42 (1981), p.297.

Google Scholar

[3] COST 507 - Termochemical database for light metal alloys, vol. 2, eds. I. Ansara, A.T. Dinsdale, M. H Rand, July 1998, European Communities, pp.4-10.

Google Scholar

[4] A.T. Dinsdale, Calphad Vol. 15 (1991), p.317.

Google Scholar

[5] Version 4. 4 of the SGTE Unary database.

Google Scholar

[6] A.T. Dinsdale, A. Watson, A. Kroupa, J. Vřešťál, A. Zemanová and J. Vízdal: Version 2. 1 of the COST 531 Database for Lead Free Solders.

DOI: 10.1007/s11837-007-0084-6

Google Scholar

[7] J.H. Shim, C.S. Oh, B.J. Lee and D.N. Lee: Z. Metallkd. Vol. 87 (1996), p.205.

Google Scholar

[8] X.J. Liu, H.S. Liu, I. Ohnuma, R. Kainuma, K. Ishida, S. Itabashi, K. Kameda and K. Yamaguchi: J. Electron. Mater. Vol. 9 (2001), p.1093.

Google Scholar

[9] C. -S. Oh, J. -H. Shim, B. -J. Lee and D.N. Lee: J. Alloy. Compd. Vol. 238 (1996), p. 155B. Jönsson and J. Ågren: Mat. Sci. Technol. Vol. 2 (1986), p.913.

Google Scholar

[11] V. Vassiliev, Y. Feutelais, M. Sghaier and B. Legendre: J. Alloy. Compd. Vol. 314 (2001), p.198.

Google Scholar

[12] B. Predel and W. Schwermann: J. Inst. Met. Vol. 99 (1971), p.169.

Google Scholar

[13] K. Iwasé, N. Aoki and A. Osava: Sci. Rep. Res. Inst. Vol. 20 (1931), p.353.

Google Scholar

[14] D. Hanson and W.T. Pell-Wallpole: J. Inst. Met. Vol. 58 (1936), p.299.

Google Scholar