High Density Interconnect for Advanced VLSI Packaging

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Edited by:

D. Gupta, A.D. Romig and M.A. Dayananda

Pages:

129-136

Citation:

A.C. Adams et al., "High Density Interconnect for Advanced VLSI Packaging", Defect and Diffusion Forum, Vol. 59, pp. 129-136, 1988

Online since:

January 1991

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