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Paper Titles
High Density Interconnect for Advanced VLSI Packaging
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Diffusion in Metallic Thin Films
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High Resolution Transmission Electron Microscopy of Grain Boundaries
p.151
Tunneling Microscopy of Surface Diffusion
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Characterization of Interfacial Chemistry by Analytical Electron Microscopy
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Solute Interactions in Metals
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Oxygen Diffusion in High Tc-Superconductors
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Tracer Diffusion of 60Co and 63Ni in Amorphous NiZr Alloy
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Tracer Diffusion in Pure and Boron-Doped Ni3Al
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Characterization of Interfacial Chemistry by Analytical Electron Microscopy

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Periodical:

Defect and Diffusion Forum (Volume 59)

Pages:

179-196

DOI:

https://doi.org/10.4028/www.scientific.net/DDF.59.179

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Online since:

January 1988

Authors:

A.D. Romig, Jr.

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© 1988 Trans Tech Publications Ltd. All Rights Reserved

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