Compound Formation and Interfacial Instability in the Au-Cu-Sn System at Low Temperature

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Periodical:

Edited by:

D. Gupta, A.D. Romig and M.A. Dayananda

Pages:

271-0

DOI:

10.4028/www.scientific.net/DDF.59.271

Citation:

J.F. Roeder et al., "Compound Formation and Interfacial Instability in the Au-Cu-Sn System at Low Temperature", Defect and Diffusion Forum, Vol. 59, pp. 271-0, 1988

Online since:

January 1991

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$35.00

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