Study of Temperature Dependence of the Contact Angle in the Liquid Tin–Tungsten Substrate System

Abstract:

The paper deals with an experimental determination of the temperature dependence of the contact angle of wetting of the tungsten substrate by liquid tin using the sessile drop method. Unlike the traditional method of heating of one drop of melt on a solid substrate, here a new similar drop of liquid tin was supplied through the capillary as the temperature increased. It was found that the values of the contact angle decreased with the growing temperature, but these values increased again at higher temperatures. Our findings indicate that, as applied to the tin–tungsten system, the curve of temperature dependence of the contact angle shows the sections of an anomalous increase in values of the contact angle as the temperature rises. We observed this effect earlier in the tin–steel system, and it was given a theoretical explanation from the standpoint of the quantum-mechanical model of Wentzel–Kramers–Brillouin quasiclassical representations.

• Periodical: Key Engineering Materials (Volume 1046)
• Pages: 19-26
• DOI: https://doi.org/10.4028/p-T0nYAi
• Online since: March 2026
• Authors: Yuliya Syrovatko*, Eduard Shtapenko
• Keywords: Contact Angle, Drop of Liquid Tin, Temperature, Tungsten Substrate, Work of Adhesion

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