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HomeKey Engineering MaterialsKey Engineering Materials Vols. 171-174Compressive Creep and Stress Relaxation Kinetics...

Compressive Creep and Stress Relaxation Kinetics in a High Purity Silicon Nitride Ceramics in the 1400-1650 °C Range

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Creep and Fracture of Engineering Materials and Structures

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Periodical:

Key Engineering Materials (Volumes 171-174)

Pages:

817-824

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.171-174.817

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Online since:

October 1999

Authors:

S. Testu, J.L. Besson, Tanguy Rouxel, G.B. Granger

Keywords:

Creep, GPS Silicon Nitride, Microstructure, Stress Relaxation

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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