Compressive Creep and Stress Relaxation Kinetics in a High Purity Silicon Nitride Ceramics in the 1400-1650 °C Range

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Periodical:

Key Engineering Materials (Volumes 171-174)

Edited by:

T. Sakuma, K. Yagi

Pages:

817-824

DOI:

10.4028/www.scientific.net/KEM.171-174.817

Citation:

S. Testu et al., "Compressive Creep and Stress Relaxation Kinetics in a High Purity Silicon Nitride Ceramics in the 1400-1650 °C Range", Key Engineering Materials, Vols. 171-174, pp. 817-824, 2000

Online since:

October 1999

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$35.00

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