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HomeKey Engineering MaterialsKey Engineering Materials Vols. 181-182Thin Film Metallization for Aluminum Nitride

Thin Film Metallization for Aluminum Nitride

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Electroceramics in Japan III

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Periodical:

Key Engineering Materials (Volumes 181-182)

Pages:

129-134

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.181-182.129

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Online since:

May 2000

Authors:

Yoshihiko Imanaka, Anant K. Agarwal, Kishio Yokouchi

Keywords:

Aluminum Nitride (AlN), Interfacial Reaction, MCM, Metallization, Microstructure, Titanium (Ti)

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© 2000 Trans Tech Publications Ltd. All Rights Reserved

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