Preface
Essential Aspects of Chemical Mechanical Planarization for Oxide Semiconductor
p.1
p.1
A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process
p.25
p.25
Some Essentials of Simulating Nano-Surfacing Processes Using the Molecular Dynamics Method
p.31
p.31
Assessment of the Exit Defects in Carbon Fibre-Reinforced Plastic Plates Caused by Drilling
p.43
p.43
Grinding of Ceramics: Strength, Surface Features and Grinding Conditions
p.53
p.53
Grinding Burn Mechanism of Directionally Solidified Superalloy
p.61
p.61
Wear Mechanism of Diamond Cutting Tool in Machining of Steel
p.69
p.69
A Friction Model for Free-Machining Steels and Its Applicability to Machinability Analysis
p.79
p.79
Preface
Abstract:
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Info:
Periodical:
Key Engineering Materials (Volume 196)
Online since:
January 2001
Сopyright:
© 2001 Trans Tech Publications Ltd. All Rights Reserved
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