A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process

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Periodical:

Edited by:

L. Zhang

Pages:

25-30

DOI:

10.4028/www.scientific.net/KEM.196.25

Citation:

J. Watanabe et al., "A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process", Key Engineering Materials, Vol. 196, pp. 25-30, 2001

Online since:

January 2001

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$35.00

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