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A Novel Chemical-Mechanical Planarization Technology Using Pre-Thin-Surface Grinding in ULSI Manufacturing Process

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Periodical:

Key Engineering Materials (Volume 196)

Pages:

25-30

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.196.25

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Online since:

January 2001

Authors:

Junji Watanabe, R. Etoh, M. Hirano

Keywords:

Activation Energy, Chemical Mechanical Polishing (CMP), Planarization Polishing, Strained Layer, Thin Surface Grinding

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© 2001 Trans Tech Publications Ltd. All Rights Reserved

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