Oxygen Influence on Wetting and Bonding between Copper and Aluminum Nitride

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Periodical:

Key Engineering Materials (Volumes 206-213)

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Edited by:

C. Kermel, V. Lardot, D. Libert and I. Urbain

Pages:

535-538

Citation:

T. Joyeux et al., "Oxygen Influence on Wetting and Bonding between Copper and Aluminum Nitride", Key Engineering Materials, Vols. 206-213, pp. 535-538, 2002

Online since:

December 2001

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