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HomeKey Engineering MaterialsKey Engineering Materials Vols. 206-213Oxygen Influence on Wetting and Bonding between...

Oxygen Influence on Wetting and Bonding between Copper and Aluminum Nitride

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Euro Ceramics VII

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Periodical:

Key Engineering Materials (Volumes 206-213)

Pages:

535-538

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.206-213.535

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Online since:

December 2001

Authors:

Thierry Joyeux, Jean Jarrige, J.C. Labbe, J.P. Lecompte, T. Alexandre

Keywords:

Aluminum Nitride (AlN), Copper (Cu), Direct Bonding Copper DBC, Joining, Oxygen, Thermal Property, Wettability

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© 2002 Trans Tech Publications Ltd. All Rights Reserved

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