Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films

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Periodical:

Key Engineering Materials (Volumes 230-232)

Edited by:

Teresa Vieira

Pages:

513-516

DOI:

10.4028/www.scientific.net/KEM.230-232.513

Citation:

C. Louro et al., "Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films", Key Engineering Materials, Vols. 230-232, pp. 513-516, 2002

Online since:

October 2002

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$35.00

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