Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films

C. Louro; Filipe Teixeira Dias; Luis Filipe Menezes; Albano Cavaleiro

doi:10.4028/www.scientific.net/KEM.230-232.513

Paper Titles

Microstructure-Based Constitutive Modeling for the Analysis and Design of Aluminium Sheet Forming Processes
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Finite-Element Simulation and Experimental Validation of a Plasticity Model of Texture and Strain-Induced Anisotropy
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Damage-Induced Anisotropy and Deformability of Brittle Rock-Like Materials
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Taylor Analysis for {111}<112> Twinning on One System and {111}<110> Slip Under Tension and Compression Flow Conditions
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Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films
p.513

On the Compensation Law Observed in Thermally Stimulated Current Experiments
p.517

Strain Hardening Anisotropy of Aluminium Alloys during Complex Loading: Strain Reversal Effects
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Numerical Study of the Influence of Imperfection of the Tip of a Vickers Indenter on Ultramicrohardness Test Results
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Forming Limit Diagram for 6016-T4 Aluminium Alloy Deformed along Linear and Complex Strain Paths
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 230-232Effect of the Substrate Thermal Expansion...

Effect of the Substrate Thermal Expansion Coefficient on the Thermal Residual Stresses in W-Si-N Sputtered Films

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Periodical:

Key Engineering Materials (Volumes 230-232)

Pages:

513-516

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.230-232.513

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Online since:

October 2002

Authors:

C. Louro, Filipe Teixeira Dias, Luis Filipe Menezes, Albano Cavaleiro

Keywords:

Hardness, Modeling, Residual Stress, Sputtering

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