Geometry Sensitivity Analyses of Micro-Structures of IC Packages on Metal Lines Shifting Induced by Plastic Deformation

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Periodical:

Key Engineering Materials (Volumes 274-276)

Edited by:

W.P. Shen and J.Q. Xu

Pages:

361-366

DOI:

10.4028/www.scientific.net/KEM.274-276.361

Citation:

Y.T. He et al., "Geometry Sensitivity Analyses of Micro-Structures of IC Packages on Metal Lines Shifting Induced by Plastic Deformation ", Key Engineering Materials, Vols. 274-276, pp. 361-366, 2004

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October 2004

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$35.00

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