Geometry Sensitivity Analyses of Micro-Structures of IC Packages on Metal Lines Shifting Induced by Plastic Deformation

Abstract:

• Periodical: Key Engineering Materials (Volumes 274-276)
• Pages: 361-366
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.274-276.361
• Online since: October 2004
• Authors: Y.T. He, G.Q. Zhang, F. Li, L.J. Ernst, Jack Zhang
• Keywords: IC, Influence of Geometry, Interconnect, Metal Lines Shifting, Package, Plastic Strain, Response Surface Model

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