Paper Title:
Geometry Sensitivity Analyses of Micro-Structures of IC Packages on Metal Lines Shifting Induced by Plastic Deformation
  Abstract

  Info
Periodical
Key Engineering Materials (Volumes 274-276)
Edited by
W.P. Shen and J.Q. Xu
Pages
361-366
DOI
10.4028/www.scientific.net/KEM.274-276.361
Citation
Y.T. He, G.Q. Zhang, F. Li, L.J. Ernst, J. Zhang, "Geometry Sensitivity Analyses of Micro-Structures of IC Packages on Metal Lines Shifting Induced by Plastic Deformation ", Key Engineering Materials, Vols. 274-276, pp. 361-366, 2004
Online since
October 2004
Export
Price
$35.00
Share

In order to see related information, you need to Login.

In order to see related information, you need to Login.

Authors: Yutaka Watanabe, H. Abe, Yuzo Daigo, R. Fujisawa, M. Sakaihara
Abstract:It was previously demonstrated by the authors that density of water and the density-related physical properties of water are ones of the...
1031
Authors: Jae Bon Koo, Jung Wook Lim, Chan Hoe Ku, Sang Chul Lim, Jung Hun Lee, Seong Hyun Kim, Sun Jin Yun, Yong Suk Yang, Kyung Soo Suh
Abstract:We report on the fabrication of dual-gate pentacene organic thin-film transistors (OTFTs) using a plasma-enhanced atomic layer deposited...
383
Authors: Ramiro M. Irastorza, Sergio Valente, Fernando Vericat, Eugenia Blangino
Abstract:The increasing research on development of novel bio-materials has resulted in several studies on non-destructive evaluation methods for...
730
Authors: Satoshi Yokomizo, Takuya Hoshina, Hiroaki Takeda, Katsuya Taniguchi, Youichi Mizuno, Hirokazu Chazono, Osamu Sakurai, Takaaki Tsurumi
Abstract:We researched the phenomenon that the permittivity of dielectric layers in multilayer ceramic capacitor (MLCC) increases with the number of...
31
Authors: P. Anithambigai, D. Mutharasu
Chapter 16: Semiconductor Materials Manufacturing
Abstract:This study elucidates the significance of thermal transient measurement based on structure function evaluation particularly on high power...
1363