High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

Ikuo Shohji; Tsukasa Sakurai; Shinji Arai

doi:10.4028/www.scientific.net/KEM.297-300.2819

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 297-300High-Speed Bonding of Resin-Coated Cu Wire and Sn...

High-Speed Bonding of Resin-Coated Cu Wire and Sn Electrode with Ultrasonic Bonding for High-Frequency Chip Coil

Abstract:

High-speed ultrasonic bonding method has been developed to join resin-coated Cu wire on Sn electrodes for high-frequency chip coils. Two-step amplitude method, which decreases the ultrasonic amplitude in the bonding process, was effective to join the resin-coated Cu wire on Sn electrodes. The surface roughness treatment for a bonder head accelerated the deformation of the wire in the bonding process and improve the bondability compared to using the bonder head without that treatment. This paper also describes bonding properties of the joint and the bonding mechanism.

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

2819-2824

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.2819

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Online since:

November 2005

Authors:

Ikuo Shohji, Tsukasa Sakurai, Shinji Arai

Keywords:

Chip Coil, Joint Strength, Resin-Coated Cu Wire, Sn Electrode, Ultrasonic Bonding

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References

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