The Study on Fatigue Life of Interconnect with Respect to Geometrical Shape of Supporting Structure and Load Conditions in MEMS

Abstract:

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Recently, application of semiconductor sensors has widely spreaded into various industries becasuse those have several merits like easy miniaturization and batch production etc. But external conditions such as thermal and repetitive load have a bad effect on sensors’s lifetime. Therefore, lots of studies related with the fatigue of microelectromechnical systems (MEMS) have been conducted. Especially, this paper was focused on fatigue life of aluminum interconnect in the supporting structure of sensor under cyclic thermal load and on the approximation equation defining the critical temperature to ensure required operating life using FEM simulation.

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

539-544

DOI:

10.4028/www.scientific.net/KEM.297-300.539

Citation:

J. J. Shim et al., "The Study on Fatigue Life of Interconnect with Respect to Geometrical Shape of Supporting Structure and Load Conditions in MEMS ", Key Engineering Materials, Vols. 297-300, pp. 539-544, 2005

Online since:

November 2005

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Price:

$38.00

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