New Structures and Techniques for Easy Axial Loading Test of Static and Fatigue Properties of MEMS Materials

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Abstract:

Mechanical property evaluation of micrometer-sized structures is necessary to help design reliable microelectromechanical systems (MEMS) devices. Most material properties are known to exhibit dependence on specimen size and such properties of microscale structures are not well characterized. This paper describes techniques developed for tensile testing of materials used in MEMS. Epi-polycrystalline silicon is currently the most widely used material, and its tensile strength has been measured as 1.52GPa. We have developed an axial testing machine for testing microscale specimen using electro-magnetic actuator. The field magnet and the moving coil taken from an audio-speaker were utilized as the components of the actuator. Structure of specimen was designed and manufactured for easy handling and alignment. In addition to the static tensile tests, new techniques and procedures for measuring strength are described.

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Key Engineering Materials (Volumes 297-300)

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545-550

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November 2005

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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[1] S. Johansson, J.A. Schweitz, L. Tenez and J. Tiren: Fracture testing of silicon micro-elements in situ in a scanning electron microscope, J. Appl. Phys. 62 (10) (1988), pp.4799-4803.

Google Scholar

[2] K. Komai, K. Minoshima, H. Tawara, S. Inoue and K. Sunako: Development of mechanical testing machine for micro-elements and fracture strength evaluaion of single-crystalline sislicon micro-elements, Trans. Jpn. Sco., Mech. Eng. A 60-569 (1994).

Google Scholar

[3] E.I. Bromley, J.N. Randall, D.C. Flanders and R.W. Mountain: A techniqu for the determination of stress in thin-films, J. Vac. Sci. Technol. B 1 (4) (1983), pp.1364-1366.

Google Scholar

[4] O. Tabata, K. Kawashata, S. Sugiyama and I. Igarashi: Mechanical property measurement of thin- films using load-deflection of composite rectangular membrane, in: Proceedings of the IEEE Micro- Electro Mechanical Systems Workshop (1989).

DOI: 10.1109/memsys.1989.77981

Google Scholar

[5] J. Koskinen, J.E. Steinwall, R. Soave and H.H. Johnson: Microtensile test of free-standing polysilicon fibers of various grain sizes, J. Micromech. Microeng. 3 (1993), pp.13-17.

DOI: 10.1088/0960-1317/3/1/004

Google Scholar

[6] T. Tsuchiya, O. Tabata, J. Sakata and Y. Taga: Specimen size effect on tensile strength of surface micro-machined polycrystalline silicon thin-films, in: Proceedings of the IEEE MEMS '97 (1997), pp.529-534.

DOI: 10.1109/memsys.1997.581921

Google Scholar

[7] S. Greek, F. Ericson, S. Johansson, M. Furtsch and A. Rump: Mechanical characterization of thick polysilicon films: Young, s modulus and fracture strength evaluated with microstructure, J. Micromech. Microeng. 9 (1999), pp.245-251.

DOI: 10.1088/0960-1317/9/3/305

Google Scholar

[8] W.N. Sharpe Jr., B. Yuan, R. Vaidyanathan and R.L. Edwards: Measurement of young's modulus, Poisson's ratio, and tensile strength of polysilicon, in: Proceedings of the IEEE MEMS '97 (1997), pp.424-429.

Google Scholar