For Libraries For Publication Open Access Downloads About Us Contact Us
Paper Titles
Influence of Containerless Solidification on Hardness in Multifunctional Titanium Based Alloys
p.495
Simple Estimation of Deformation-Induced Martensite in Stainless Steel
p.500
Tensile and Fracture Behavior of NbSS/Nb5Si3 In Situ Composites Prepared by Arc Melting
p.507
Measuring Residual Stress with the Indentation Method in Struc­tural Ceramics
p.515
A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate
p.521
Strength Analysis of MEMS Micromirror Devices - Effects of Loading Mode and Etching Damage
p.527
Mechanical Properties and Process of ZnO Deposited Various Substrates
p.533
The Study on Fatigue Life of Interconnect with Respect to Geometrical Shape of Supporting Structure and Load Conditions in MEMS
p.539
New Structures and Techniques for Easy Axial Loading Test of Static and Fatigue Properties of MEMS Materials
p.545

A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate

Article Preview

Abstract:

A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

You might also be interested in these eBooks
Advances in Fracture and Strength View Preview

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

521-526

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.521

Citation:

Cite this paper

Online since:

November 2005

Authors:

Insu Jeon, Masaki Omiya, Hirotsugu Inoue, Kikuo Kishimoto, Tadashi Asahina

Keywords:

Al-0.5%Cu Thin Film, Indentation, Interfacial Toughness, New Specimen

Export:

RIS, BibTeX

Price:

Permissions CCC:

Request Permissions

Permissions PLS:

Request Permissions

Сopyright:

© 2005 Trans Tech Publications Ltd. All Rights Reserved

Share:

Citation:

References

[1] D.B. Marshall and A.G. Evans: J. Appl. Phys. Vol. 56 (1984), p.2632.

Google Scholar

[2] L.G. Rosenfeld, J.E. Ritter, T.J. Lardner and M.R. Lin: J. Appl. Phys. Vol. 67 (1990), p.3291.

Google Scholar

[3] M.P. De Boer and W.W. Gerberich: Acta Mater. Vol. 44 (1996), p.3169.

Google Scholar

[4] S. Venkataraman, D. Kohlstedt and W.W. Gerberich: J. Mater. Res. Vol. 7 (1992), p.1126.

Google Scholar

[5] N.R. Moody, R. Hwang, S. Venkataraman, J. Angelo, D. Norwood and W.W. Gerberich: Acta Mater. Vol. 46 (1998), p.585.

Google Scholar

[6] I. Jeon, Y.B. Park, H. Inoue and K. Kishimoto: Key Eng. Mater. Vol. 261-263 (2004), p.507.

Google Scholar

[7] S. Johansson, J. Shuweiz, L. Tenerz and J. Tiren: J. Appl. Phy. Vol. 63 (1988), p.4799.

Google Scholar

[8] J.M. Ambrico and M.R. Begley: Engng. Fract. Mech. Vol. 70 (2003), p.1721.

Google Scholar

[9] Y. Taechung and C.J. Kim: Meas. Sci. Technol. Vol. 10 (1999), p.706.

Google Scholar

[10] A. Bagchi and A.G. Evans: Thin Solid Films Vol. 286 (1996), p.203.

Google Scholar

[11] J.R. Rice: ASME J. Appl. Mech. Vol. 55 (1988), p.98.

Google Scholar

[12] J.W. Hutchinson and Z. Suo: Adv. Appl. Mech. Vol. 29 (1992), p.63.

Google Scholar

[13] ABAQUS Standard User's Manual 6. 2.

Google Scholar

[14] A.A. Volinsky, N.R. Moody and W.W. Gerberich: Acta Mater. Vol. 50 (2002), p.441.

Google Scholar

© 2025 Trans Tech Publications Ltd. All rights are reserved, including those for text and data mining, AI training, and similar technologies. For open access content, terms of the Creative Commons licensing CC-BY are applied.
Scientific.Net is a registered trademark of Trans Tech Publications Ltd.