A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate

Abstract:

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A new specimen is proposed to measure the interfacial toughness between the Al-0.5%Cu thin film and the Si substrate. The plain and general micro-fabrication processes are sufficient to fabricate the specimen. With the help of the finite element method and the concepts of the linear elastic fracture mechanics, the detailed structure for this specimen is modeled and evaluated. The results obtained from this research show that the proposed specimen provides efficient and convenient method to measure the interfacial toughness between the Al-Cu thin film and the Si substrate.

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

521-526

DOI:

10.4028/www.scientific.net/KEM.297-300.521

Citation:

I. Jeon et al., "A New Specimen for Measuring the Interfacial Toughness of Al-0.5%Cu Thin Film on Si Substrate ", Key Engineering Materials, Vols. 297-300, pp. 521-526, 2005

Online since:

November 2005

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Price:

$35.00

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