Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device

Min Seog Choi; Sung Hoon Choa

doi:10.4028/www.scientific.net/KEM.297-300.588

Paper Titles

Influence of Groove Slotting for Micro-Sensor Embedding on Smart Bearing's Mechanical Characteristics
p.562

Development of Full-Reversed Bending Fatigue Tester Based on AFM Technique for Cyclic Damage Evaluation of MEMS
p.567

XRD Tensile Test Technique to Measure Mechanical Properties of Micron-Thick Si and TiN Films
p.574

Effect of Thickness on Grain Growth in Electrodeposited Copper Film by Cyclic Stressing
p.581

Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device
p.588

Analysis of Time-Dependent Degradation of a Micro-Resonating Structure with a Notch
p.594

Evaluation of Shape Recovery Force by Electric Heating of TiNi Shape-Memory Alloy Reinforced Composites
p.603

Apparent Negative Piezoresistivity of Single-Ply CFRP due to Poor Electrical Contact of Four-Probe Method
p.610

Equivalent Modeling for Shape Design of IPMC (Ionic Polymer-Metal Composite) as Flapping Actuator
p.616

HomeKey Engineering MaterialsKey Engineering Materials Vols. 297-300Experimental Reliability Estimation and...

Experimental Reliability Estimation and Improvement for a Wafer Level Vacuum Packaged MEMS Device

Abstract:

We carry out reliablity tests and investigate the failure mechanisms for wafer level vacuum packaged (WLVP) MEMS resonator using an accelerated degradation test (ADT). ADT is also used to estimate the mean life-time (or failure) of WLVP. The main failure mechanism of WLVP is found to be outgassing inside the package. Failure distribution of log-logistic is well fitted with the failure data from ADT, and Arrhenius model is used as a stress-life model because the main stress parameter is temperature. Acceleration factor (AF) for temperature levels is calculated and used to evaluate mean life-time of the WLVP after redesign. Finally the accuracy of ADT model is examined by verification test. The successful WLVP is achieved by reducing outgassing through the deposition of titanium coating inside the package as a getter material.