Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders

Takashi Hasegawa; Masumi Saka

doi:10.4028/www.scientific.net/KEM.297-300.837

Paper Titles

Nonlinear Ultrasonic Method to Detect Micro-Delamination in Electronic Packaging
p.813

Geometry Sensitivity Analyses of Microstructures of IC Packages on Passivation Cracking
p.819

Effects of Microstructure on Material Behaviors of Solder Alloys
p.825

A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints
p.831

Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders
p.837

Fracture Mechanic Analysis for Package Delamination
p.844

Analysis of the Test Parameters in the Shear Test of BGA Solder Joints
p.851

Shear Strength of Fluxless Solder Joints between Sn and In Bumps
p.857

Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM
p.863

HomeKey Engineering MaterialsKey Engineering Materials Vols. 297-300Diagram of Electromigration Pattern in Eutectic...

Diagram of Electromigration Pattern in Eutectic Pb-Sn and Pb-Free Solders

Abstract:

Solder is the most frequently used alloy, which serves as the bonding metal for electronics components. Recently, the interconnected bump is distinctly downsizing its bulk along with the integration of high-density packaging. The evaluation of electromigration damage for solder bumps is indispensable. Hence, it is fairly urgent to understand the mechanism of the electromigration damage to be capable of securing reliability of the solder bump and ultimately predicting its failure lifetime. Electromigration pattern in multi-phase material is determined by the combination of current density, temperature and current-applying time. In this paper, diagram of electromigration pattern (DEP) in solders is presented, where both of eutectic Pb-Sn and Pb-free solders are treated. DEP gives the basis for discussing and predicting the electromigration damage in solders.