A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

Abstract:

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Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life.

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

831-836

DOI:

10.4028/www.scientific.net/KEM.297-300.831

Citation:

I. H. Kim et al., "A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints ", Key Engineering Materials, Vols. 297-300, pp. 831-836, 2005

Online since:

November 2005

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Price:

$35.00

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