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A Comparative Study of The Fatigue Behavior of SnAgCu and SnPb Solder Joints

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Abstract:

Fatigue behaviors of 63Sn37Pb and two types of lead-free solder joints were compared using pseudo-power cycling testing method, which provides more realistic load cycling to solder joints than chamber cycling method does. Pseudo-power cycling test was performed in various temperature ranges to evaluate the shear strain effect. A nonlinear finite element model was used to simulate the thermally induced visco-plastic deformation of solder joint in BGA packages. The results revealed that lead free solder joints have a good fatigue property in the low temperature condition, where a small strain was induced. In the high temperature condition where a large strain was induced, however, lead contained solder joints have a longer fatigue life.

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

831-836

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.831

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Online since:

November 2005

Authors:

Il Ho Kim, Tae Sang Park, Se Young Yang, Soon Bok Lee

Keywords:

Fatigue, Finite Element Model (FEM), Lead-Free Solder, Power Cycling

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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