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HomeKey Engineering MaterialsKey Engineering Materials Vols. 297-300Shear Strength of Fluxless Solder Joints between...

Shear Strength of Fluxless Solder Joints between Sn and In Bumps

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

857-862

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.857

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Online since:

November 2005

Authors:

Seung Hyun Lee, Young Ho Kim

Keywords:

Ag Capping Layer, Fluxless Bonding, In Bump, Shear Strength, Sn Bump

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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