Time-Dependent Cyclic Deformation and Failure Behavior and Its Damage Coupled Simulation for Solder Alloy 63Sn-37Pb

Xianjie Yang; Qing Gao

doi:10.4028/www.scientific.net/KEM.297-300.881

Paper Titles

Shear Strength of Fluxless Solder Joints between Sn and In Bumps
p.857

Investigations of Interfacial Reaction and Shear Strength between Pb-Free Flip Chip Solder and Electroplated Cu UBM
p.863

Metal Leadframe Surface Cleaning Prior to Electroplating by Atmospheric Pressure Glow Discharge Plasma
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Fabrication of Bi-Te Based Thermoelectric Semiconductors by Using Hybrid Powders
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Time-Dependent Cyclic Deformation and Failure Behavior and Its Damage Coupled Simulation for Solder Alloy 63Sn-37Pb
p.881

Chip Warpage Damage Model for ACA Film Type Electronic Packages
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Reliability Characterization of Organic Solderability Preservatives (OSP) of IC Packages by Drop and Cyclic Bend Test
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Vibration Reliability in Flip Chip Package
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Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence
p.905

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Time-Dependent Cyclic Deformation and Failure Behavior and Its Damage Coupled Simulation for Solder Alloy 63Sn-37Pb

Abstract:

The tests of 63Sn-37Pb under cyclic strain and stress were conducted to investigate the material’s time-dependent behavior. A damage-coupled viscoplastic model and its failure criterion are proposed. The prediction of the proposed viscoplastic model implies that the model can describe the cyclic strain and cyclic stress ratcheting behavior, and the fatigue lives very well.