Reliability Characterization of Organic Solderability Preservatives (OSP) of IC Packages by Drop and Cyclic Bend Test

Abstract:

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Cyclic bend test and drop test were carried out as a second level reliability test method in order to characterize the joint performance between electronic components and board. Two types of package substrates were used for the test. The one was NiAu plated, and the other one was organic solderability preservatives (OSP) finished. Drop test was done in accordance with JEDEC standard test method [1]. Drop impact and duration time was 1,500G and 0.5ms, respectively. Cyclic bend test was performed with Amkor internal specification because there is no international standard for the test. The Amkor internal specification was edited based on the IPC/JEDEC specification [2]. Board deflection and cyclic frequency was 3mm and 1Hz, respectively. NiAu substrate showed better mean life performance about by 30% in cyclic bend test. OSP substrate showed the same or better failure rate performance in drop test. Typical solder joint failures and intermetalic crack were found by failure analysis.

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

893-898

DOI:

10.4028/www.scientific.net/KEM.297-300.893

Citation:

S. M. Kim et al., "Reliability Characterization of Organic Solderability Preservatives (OSP) of IC Packages by Drop and Cyclic Bend Test ", Key Engineering Materials, Vols. 297-300, pp. 893-898, 2005

Online since:

November 2005

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Price:

$35.00

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