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HomeKey Engineering MaterialsKey Engineering Materials Vols. 297-300Chip Warpage Damage Model for ACA Film Type...

Chip Warpage Damage Model for ACA Film Type Electronic Packages

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Abstract:

The use of anisotropically conductive adhesives (ACA) for the direct interconnection of flipped silicon chips to printed circuits (flip chip packaging), offers numerous advantages such as reduced thickness, improved environmental compatibility, lowered assembly process temperature, increased metallization options, cut downed cost, and decreased equipment needs. Despite numerous benefits, ACA film type packages bare several reliability problems. The most critical issue among them is their electrical performance deterioration upon consecutive thermal cycles attributed to gradual delamination growth through chip and adhesive film interface induced by CTE mismatch driven shear and peel stresses. In this study, warpage of the chip is monitored by real time moiré interferometer during –50oC to +125oC temperature range. Moreover, reduction in chip warpage due to increase in delamination length is obtained as in function of thermal fatigue cycles. Finally, a new model to predict damage level of ACA package and remained life is proposed and developed.

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

887-892

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.887

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Online since:

November 2005

Authors:

Se Young Yang, Woon Seong Kwon, Soon Bok Lee, Kyoung Wook Paik

Keywords:

Anisotropic Conductive Film, Chip Warpage, Damage Model, Delamination, Moiré Interferometry, Twyman-Green Interferometry

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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[1] A.M. Lyons et al.: IEEE Trans. on Comp. Pack. & Manuf. Tech. Part A Vol. 19 (1996), p.5.

[2] J. Liu: Int. J. of Adhesion and Adhesives Vol. 16 (1996), p.219.

[3] M.J. Yim and K.W. Paik: IEEE Trans. on CPMT Part A Vol. 21 (1998), p.226.

[4] R. Aschenbrenner et al.: IEEE Trans on CPMT Part C Vol. 20 (1997), p.95.

[5] M.J. Yim and K.W. Paik: IEEE Trans. on Advanced Packaging Vol. 22 (1999), p.166.

[6] Z. Lai and J. Liu: IEEE Trans. on CPMT Part B Vol. 19 (1996), p.644.

[7] J. (Hans) de Vries: IEEE Trans. on Comp. Pack. & Tech. Vol. 27 (2004), p.161.

[8] M.J. Yim and K.W. Paik: IEEE Trans. on CPT Vol. 24 (2001), p.24.

[9] J.S. Rasul: Microelec. Reliab. Vol. 44 (2004), p.135.

[10] C.N. Oguibe et al.: IEEE Trans. on CPMT-Part A Vol. 21 (1998), p.235.

[11] S. Fujiwara et al.: In Proc. of Elecron. Comp. & Tech. Conf. (ECTC 2002), p.1124.

[12] J. Liu et al.: IEEE Trans. on CPT Vol. 22 (1999), p.186.

[13] A. Seppala, T. Allinniemi and E. Ristolainen: Microelec. Relib. Vol. 42 (2002), p.1547.

[14] J. (Hans) de Vries and E. Janssen: IEEE Trans. on CPT Vol. 26 (2003), p.563.

[15] J. Liu and Z. Lai: ASME J. Elecron. Pack. Vol. 124 (2002), p.240.

[16] A. Seppala and E. Ristolainen: Microelec. Reliab. Vol. 44 (2004), p.639.

[17] C.W. Tan, Y.C. Chan and N.H. Yeung: Microelec. Reliab. Vol. 43 (2003), p.481.

[18] J.H. Constable et al.: IEEE Trans. on CPT Vol. 22 (1999), p.191.

[19] A. Gladkov and A. Bar-Cohen: IEEE Trans. on CPT Vol. 22 (1999), p.200.

[20] J.C. Jagt: IEEE Trans. on CPMT Part A Vol. 21 (1998), pp.215-225.

[21] S.E. Yamada: ASME J. Electron. Pack. Vol. 114 (1992), p.1.

[22] Y. Wen and C. Basaran: Mechanics of Materials Vol. 36 (2004), p.369.

[23] E. Suhir: ASME J. of Appl. Mech. Vol. 55, p.143.

[24] K.P. Wang, Y.Y. Huang, A. Chandra, and K.X. Hu: IEEE Trans. on CPT Vol. 23 (2000), p.309.

[25] F. Delale et al.: J. Composite Materials Vol. 15 (1981), p.249.

[26] W.T. Chen and C.W. Nelson: IBM J. Res. Develop. Vol. 23 (1979), p.179.

[27] S.Y. Yang et al.: In Proc. of Inter. Con. and Expo. on Exp. and Appl. Mech. (2004 SEM X), p.478.

[28] W.C. Carpenter: J. Adhesion Vol. 25 (1991), p.55.

[29] L.L. Mercado et al.: IEEE Trans. on Advanced Packaging Vol. 26 (2003), p.152.

[30] H. Algan: J. Adh. Sci. Technol. Vol. 8 (1994), p.101.

[31] H. Kristiansen and J. Liu: IEEE Trans. on CPMT Part A. Vol. 21 (1998), p.208.

[32] R.A. Pearson et al.: IEEE Trans. on CPMT Part A Vol. 20 (1997), p.31.

[33] L. Fan, C. Tison and C.P. Wong: In Proc. of Elecron. Comp. & Tech. Conf. (ECTC 2002), p.1154.

[34] J.C. Suhling and S.T. Lin: Applic. of Experim. Mech. to Electro. Pack. ASME EEP-Vol. 13/AMD-Vol. 214 (1994), p.39.

[35] J. Romanko and W.G. Knauss: Developments in Adhesives-2 (A.J. Kinloch, Ed., Applied Science, London, U.K. 1981), ch. 5, p.173.