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HomeKey Engineering MaterialsKey Engineering Materials Vols. 297-300Vibration Reliability in Flip Chip Package

Vibration Reliability in Flip Chip Package

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Advances in Fracture and Strength

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

899-904

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.899

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Online since:

November 2005

Authors:

Meng Kao Yeh, Wei-Xun Zhong

Keywords:

Fatigue Life, Flip Chip Package, Solder, Vibration Reliability

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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