Vibration Reliability in Flip Chip Package

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Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

899-904

DOI:

10.4028/www.scientific.net/KEM.297-300.899

Citation:

M. K. Yeh and W.-X. Zhong, "Vibration Reliability in Flip Chip Package ", Key Engineering Materials, Vols. 297-300, pp. 899-904, 2005

Online since:

November 2005

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$35.00

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