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Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence

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Abstract:

A series of tensile tests at constant strain rate were conducted on tin-lead based solders with different Sn content under wide ranges of temperatures and strain rates. It was shown that the stress-strain relationships had strong temperature- and strain rate- dependence. The parameters of Anand model for four solders were determined. The four solders were 60Sn-40Pb, 40Sn-60Pb, 10Sn-90Pb and 5Sn-95Pb. Anand constitutive model was employed to simulate the stress-strain behaviors of the solders for the temperature range from 313K to 398K and the strain rate range from 0.001%sP -1 P to 2%sP -1 P. The results showed that Anand model can adequately predict the rate- and temperature- related constitutive behaviors at all test temperatures and strain rates.

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Periodical:

Key Engineering Materials (Volumes 297-300)

Pages:

905-911

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.297-300.905

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Online since:

November 2005

Authors:

Xu Chen, Li Zhang, Masao Sakane, Haruo Nose

Keywords:

10Sn90Pb, 40Sn60Pb, 5Sn95Pb, 60Sn40Pb, Solder, Strain Rate Dependence, Temperature Dependence, Tensile Stress-Strain Curve

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© 2005 Trans Tech Publications Ltd. All Rights Reserved

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