Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence

Abstract:

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A series of tensile tests at constant strain rate were conducted on tin-lead based solders with different Sn content under wide ranges of temperatures and strain rates. It was shown that the stress-strain relationships had strong temperature- and strain rate- dependence. The parameters of Anand model for four solders were determined. The four solders were 60Sn-40Pb, 40Sn-60Pb, 10Sn-90Pb and 5Sn-95Pb. Anand constitutive model was employed to simulate the stress-strain behaviors of the solders for the temperature range from 313K to 398K and the strain rate range from 0.001%sP -1 P to 2%sP -1 P. The results showed that Anand model can adequately predict the rate- and temperature- related constitutive behaviors at all test temperatures and strain rates.

Info:

Periodical:

Key Engineering Materials (Volumes 297-300)

Edited by:

Young-Jin Kim, Dong-Ho Bae and Yun-Jae Kim

Pages:

905-911

DOI:

10.4028/www.scientific.net/KEM.297-300.905

Citation:

X. Chen et al., "Tensile Stress-Strain Curves Modeling of Four Kinds of Solders with Temperature and Rate Dependence ", Key Engineering Materials, Vols. 297-300, pp. 905-911, 2005

Online since:

November 2005

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Price:

$35.00

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