On Electrorheological Effect Instantaneous Tiny Grinding Wheel for Fine Machining

F.F. Bi; Qiu Sheng Yan; N.Q. Wu

doi:10.4028/www.scientific.net/KEM.304-305.181

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 304-305On Electrorheological Effect Instantaneous Tiny...

On Electrorheological Effect Instantaneous Tiny Grinding Wheel for Fine Machining

Abstract:

As a special instantaneous bond, particle-dispersed Electrorheological-fluid (ER fluid) is used to cohere abrasive particles in the ER fluid so as to form dynamical tiny grinding wheel in grinding. This technique eliminates the dimension restriction of traditional concretion abrasive grinding wheel and is applicable in optics glass polishing to meet machining demands for micro-apparatus within millimeter or sub-millimeter microstructure. By regulating some parameters such as voltage, ingredient, volume rate of ER fluid, machining time, as well as distance between cone-tool and workpiece etc, the size, rigidity, and abrasive mutual combine-intensity of the micro grinding wheel can be controlled in order to achieve an expected machining effect. Experiments have been carried out by using SEM to analyze the characteristics in applying this technique.

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Advances in Grinding and Abrasive Technology XIII

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Periodical:

Key Engineering Materials (Volumes 304-305)

Pages:

181-185

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.304-305.181

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Online since:

February 2006

Authors:

F.F. Bi, Qiu Sheng Yan, N.Q. Wu

Keywords:

ER Fluid, Optics Glass, Special Instantaneous Bond, Tiny-Diameter Grinding Wheel

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References

[1] E. Mounier: MEMS the Alternative Semiconductor Business, in Proceedings of the 3 rd International Conference of euspen, Eindhoven, The Netherlands, 2002, p.391.

Google Scholar

[2] E. Belloy, A. Sayah, and M. A. Gijs: Sensors and Actuators, Vol. 86 (2000), pp.231-237.

Google Scholar

[3] T. Kuriyagawa, M. Saeki and K. Syoji: Precision Engineering, Vol. 26 (2002), pp.370-380.

Google Scholar

[4] W.B. Kim, S.J. Lee, Y.J. Kim and E.S. Lee: International Journal of Machine & Manufacture, Vol. 43 (2003), pp.81-88.

Google Scholar