Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer

Abstract:

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The lubrication properties of the slurry between the silicon wafer and the pad in chemical mechanical polishing (CMP) are critical to the planarity of the silicon wafer. Moreover, the suspending abrasives, which are contained in the slurry, have an extremely important influence on the lubrication properties of the slurry. In the CMP process of the large-sized silicon wafers, the influence of suspending abrasives on the slurry becomes more prominent. In order to explore the effects of suspending abrasives on the lubrication properties of the slurry under the light load conditions, a three-dimensional lubrication model based on the micro-polar fluid theory is developed. The effects of suspending abrasives on the fluid pressure acting on the wafer and the distribution of the slurry film between the silicon wafer and the pad are discussed.

Info:

Periodical:

Key Engineering Materials (Volumes 304-305)

Edited by:

Guangqi Cai, Xipeng Xu and Renke Kang

Pages:

359-363

DOI:

10.4028/www.scientific.net/KEM.304-305.359

Citation:

J.Y. Liu et al., "Effects of Suspending Abrasives on the Lubrication Properties of Slurry in Chemical Mechanical Polishing of Silicon Wafer ", Key Engineering Materials, Vols. 304-305, pp. 359-363, 2006

Online since:

February 2006

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Price:

$35.00

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