Modeling and Simulation of Lapping Processes Based on Grain Size Sensitivity Model

Yong Dai; Ju Long Yuan; Zhao Zhong Zhou; Jia Jin Zheng; Ping Zhao

doi:10.4028/www.scientific.net/KEM.304-305.389

Paper Titles

Experiment Study on the Dynamic Characteristics of the Abrasive Flow in Centrifugal Grinding
p.369

A Basic Study on Precision in Electrochemical Abrasive Lapping of Plate
p.374

The Principle of Magnetic Abrasive Finishing under Rotating Electromagnetic Field and Its Application in Surface Finishing of Heavy Crankshaft
p.379

Experimental Study on Mechanism and Performance of Magnetic Abrasive Finishing
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Modeling and Simulation of Lapping Processes Based on Grain Size Sensitivity Model
p.389

Study on the Technique of Pulse Electrochemical Mechanical Finishing
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Study on Ultra-Precise Machining of CLBO Crystal
p.398

Study on Wear Mode of Silicon Nitride Balls in Lapping Process
p.403

Theoretical Research on Gear-Honing and Manufacturing Technology with Electroplated CBN Honing Wheel
p.408

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Modeling and Simulation of Lapping Processes Based on Grain Size Sensitivity Model

Abstract:

It is of high importance to avoid scratches in lapping process. A Grain Size Sensitivity (GSS) model is put forward in this paper. The GSS is a relative parameter which defines the relative change of the depth of cutting, influenced by the change of the size of grain powders, by which it is possible to evaluate quantificationally the capability of lapping machines in avoiding scratches. It is useful for designing and using lapping machines. The simulating of lapping processes based on GSS model is carried out. The transferring of error is also discussed and a new structure of lapping plate with spring cells developed by the authors is introduced.