Thermosets Toughening by Creation of Residual Compressive Stresses

Ho Sung Kim; Nam Ho Kim

doi:10.4028/www.scientific.net/KEM.312.3

Paper Titles

Thermosets Toughening by Creation of Residual Compressive Stresses
p.3

Finite-Element-Simulation of Interfacial Crack Propagation: Cross-Check of Simulation Results with the Essential Work of Interfacial Fracture Method
p.9

Mechanical and Fracture Properties of Bamboo
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A Thermodynamic Approach to Long-Term Deformation and Damage for Polymeric Materials in Hygrothermal Environment
p.21

Advances in Three-Dimensional Fracture Mechanics
p.27

Thermal Effects of Cracked Piezoelectric Materials under Cycling Electric-Loading
p.35

Near-Tip Fields for Penny-Shaped Cracks in Magnetoelectroelastic Media
p.41

Functionally Graded Materials with Periodic Cracks Subjected to Transient Loading
p.47

Numerical Study on Two-Dimensional Crack Problems in Three-Layered Isotropic Elastic Materials
p.53

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Thermosets Toughening by Creation of Residual Compressive Stresses

Abstract:

Toughening of thermosets by creation of residual compressive stresses around microspheres is studied. Expandable hollow micro-spheres containing liquefied gas were used for the creation of residual compressive stresses. Microscopic compressive residual stresses around the micro-spheres in the vicinity of the crack tip were graphically analysed and related to macroscopic mechanical behaviour for mode I fracture. It was confirmed that toughening was due to residual compressive stresses rather post-cure effect.

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Key Engineering Materials (Volume 312)

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3-8

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.312.3

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Online since:

June 2006

Authors:

Ho Sung Kim, Nam Ho Kim

Keywords:

Fracture, Micro-Sphere, Residual Stress, Thermoset, Toughness

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