Authors: Satoshi Sunada, Keisuke Arai, Katsuhiko Mori, Masahisa Miyahara, Kazuhiko Majima
Abstract: The sintered stainless steel produced by the powder metallurgy process (P/M) has attracted a growing interest because it has the advantage of better formability to fabricate complex shape products without machining and welding. The four sintered stainless steel samples; i.e., the mono-phase SUS304L SS P/M sample (hereafter denoted as 304L), the mono-phase SUS316L SS P/M sample (hereafter denoted as 316L), the duplex-phase SUS316L and SUS434L SS P/M sample (hereafter denoted as 316L+434L), and the duplex-phase SUS316L and SUS434L SS P/M sample with copper (hereafter denoted as 316L+434L+Cu) were used in this experiment, and their corrosion behavior was investigated through the electrochemical procedure. It was confirmed from the potentiodynamic polarization test that their corrosion behavior was clearly classified into two groups. The one is for the mono-phase stainless steel group and the other is for the duplex-phase stainless steel group. Both corrosion current density (Icorr) and passivation current density (Ip) for the latter group were smaller than those for the former group, and especially the duplex-phase 316L + 434L SS sample with copper (316L+434L+Cu) showed the lowest value. This implies that the duplex-phase 316L + 434L SS sample with copper (316L+434L+Cu) has the highest corrosion resistance.
1832
Authors: Cui Rong Liu, Tuo Sheng Jia, Qing Sen Meng
Abstract: In this paper the technological experiments of static bonding has been carried out in the bonding of multi-layer Pyrex7740 Glass and Al. The joining mechanism is analyzed with SEM and EDX. It’s observed that bonding region across the interface consists of the metal layer, oxide transitional layer and the glass layer. The bonding process can mainly be categorized into anodic process and solid state diffusing process. The pile-up of the ions and its drift in the interface area are the main reasons for anode oxidation and joining successfully. The analysis of the shear stress and deformation in the static bonded samples was made by MARC. Modeling studies showed the maximum shear stress of bonded samples all occur in the transition layer. It also shows the shear stress and deformation in the three-layer samples is significantly smaller than that in the two-layer samples. This has an important advantage in MEMS fabrication.
361
Authors: Muhammad Hafiz Ab Aziz, Zaliman Sauli, Vithyacharan Retnasamy, Hussin Kamarudin, Wan Mokhdzani Wan Norhaimi, Moganraj Palianysamy
Abstract: In this paper, the bondability of silicon bonded to different glass based material was studied by analyzing the bond strength comparison using the anodic bonding approach. The three types of glass based surface used were silica, pyrex, and soda lime glass. Experiments were carried out using an in-house designed anodic bonder and the bond strength were measured using a bond strength tester. Silicon will be placed on the positive terminal while the glass based materials will be placed on the negative terminal. The anodic process was done in two sets which are before and after the cleaning process for each sample. For every set, there are three different bonding partners, which are silicon with silica, silicon with Pyrex, and silicon with soda lime glass. From the results, it can be seen that majority of the samples showed higher bond strength after the cleaning process. Silicon bonded to soda lime glass showed the highest bond strength compared with other materials. This was followed by silicon to pyrex bonding and finally silicon to silica bonding. The maximum bond strength for all samples achieved in the range of 25 until 35 minutes of bonding time. After that, all samples show a critical decrease of bond strength except for the bonding process between silicon doped boron and silica. Cleaning process was proven a critical factor to achieve better bondability as shown in the higher bond strength obtained.
437
Authors: Muhammad Hafiz Ab Aziz, Zaliman Sauli, Vithyacharan Retnasamy, Hussin Kamarudin, Wan Mokhdzani Wan Norhaimi, Moganraj Palianysamy
Abstract: Silicon wafer bonding opens possibilities in creating MEMS devices and anodic bonding is found to be the most relevant wafer bonding technique process in constructing and packaging MEMS. This paper reports on the bond strength comparison between silicon and different glass based materials via anodic bonding. Two types of glass based surface used pyrex and soda lime glass. Bonding temperature is set at room temperature while a high direct current voltage of 15kV. Experiments were carried out using an in-house designed anodic bonder and the bond strength were measured using a bond strength tester. The anodic approach process was done in two sets which are before and after the cleaning process for each sample. Results show that all samples showed higher bond strength after the cleaning process. Silicon-soda lime glass have higher bonding strength of 1950 Pa compared to silicon-pyrex bonding which only gives 1850 Pa of bond strength.
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