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HomeKey Engineering MaterialsKey Engineering Materials Vols. 345-346Vibration Fracture Behavior of Sn-xCu Lead-Free...

Vibration Fracture Behavior of Sn-xCu Lead-Free Solders

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The Mechanical Behavior of Materials X

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Periodical:

Key Engineering Materials (Volumes 345-346)

Pages:

477-480

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.345-346.477

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Online since:

August 2007

Authors:

Fei Yi Hung, Truan Sheng Lui, Li Hui Chen, Nien Ting He

Keywords:

Lamellar-Deformed Structures(LDS), Lead-Free Solder, Sn-Cu, Vibration

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© 2007 Trans Tech Publications Ltd. All Rights Reserved

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