Vibration Fracture Behavior of Sn-xCu Lead-Free Solders

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Periodical:

Key Engineering Materials (Volumes 345-346)

Edited by:

S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim

Pages:

477-480

DOI:

10.4028/www.scientific.net/KEM.345-346.477

Citation:

F. Y. Hung et al., "Vibration Fracture Behavior of Sn-xCu Lead-Free Solders", Key Engineering Materials, Vols. 345-346, pp. 477-480, 2007

Online since:

August 2007

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$35.00

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