The Mechanical Behavior of Materials X

The Mechanical Behavior of Materials X

Description:

Volume is indexed by Thomson Reuters CPCI-S (WoS).
The objective of this collection was to gather together the latest information on the mechanical behavior of materials. The volumes cover the progress made in all aspects of the mechanical behavior of materials, seen from both the macroscopic and microscopic viewpoints.

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Info:

Editors:
S.W. Nam, Y.W. Chang, S.B. Lee and N.J. Kim
THEMA:
TGM
BISAC:
TEC021000
Details:
10th International Conference on The Mechanical Behavior of Materials, May 27-31, 2007, BEXCO, Busan, Korea
Pages:
1658
Year:
2007
ISBN-13:
9780878494408
ISBN-13 (CD):
9783908453673
ISBN-13 (eBook):
9783038131298
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Review from Ringgold Inc., ProtoView: The 482 papers of this proceedings were first presented at the 10th International Conference on the Mechanical Behavior of Materials, held in Busan, Korea, in May 2007 and organized by the Korean Institute of Metals and the Korean Society of Mechanical Engineers. With scientists participating from 28 countries, these two volumes contain the current research in the field from an international perspective. The papers are grouped into 17 sections, including deformation behavior, fatigue, fracture and fracture mechanics, creep and superplasticity, failure mechanism and analysis, and nanostructured polymers and polymer nanocomposites. Individual paper topics include viscoelastic analysis of adhesively bonded double-lap joint, the mechanical properties of 91% tungsten alloy, and prevention of dicing-induced damage in semiconductor wafers. Both keyword and author indexes are provided.