Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package

Abstract:

Article Preview

The effect of the mechanical and physical properties of an underfill material on thermal stress relief in a lead-free chip size package (CSP) solder joint has been investigated. Thin sheets of underfill materials for the CSP solder joint were prepared and the mechanical and physical properties of the sheets were investigated. Using these properties, thermal stress relief in an encapsulated CSP lead-free solder joint with the underfill material was examined by a finite element analysis method under thermal cycle conditions in the temperature range from 293K to 398K and 233K.

Info:

Periodical:

Key Engineering Materials (Volumes 353-358)

Edited by:

Yu Zhou, Shan-Tung Tu and Xishan Xie

Pages:

2029-2032

Citation:

I. Shohji et al., "Effect of Properties of Underfill Materials on Thermal Stress Relief in Lead-Free Solder Joint of Chip Size Package", Key Engineering Materials, Vols. 353-358, pp. 2029-2032, 2007

Online since:

September 2007

Export:

Price:

$38.00

[1] J. H. Lau and Y. H. Pao: Solder Joint Reliability of BGA, CSP, Flip Chip, and Fine Pitch SMT Assemblies (McGraw-Hill USA 1997).

[2] M. Ogawa, R. Murakami, M. Sumikawa and H. Matsubara: Proc. of MES2002 (2002), p.155.

[3] H. Schaefer, U. Maurieschat, H. Schimanski, M. H. Poech, E. Hoefer and T. Harder: Proc. of 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics (2004), p.153.

DOI: https://doi.org/10.1109/polytr.2004.1402756

[4] A. Yaguchi, M. Nakamura, T. Ishikawa, K. Kurosawa and R. Kimoto: Journal of Japan Institute of Electronics Packaging Vol. 7 (2004), p.613.

[5] Y. Kariya, T. Asai, T. Suga and M. Otsuka: TMS Letters Vol. 1 (2004), p.169.

[6] Y. Kariya, T. Niimi, T. Suga and M. Otsuka: Materials Transactions Vol. 46 (2005), p.2309.

[7] I. Shohji, K. Yosizawa, M. Mishimoto and T. Kawano: Smart Processing Technology Vol. 1 (2006), p.175.

[8] I. Shohji, H. Mori and Y. Orii: Microelectronics Reliability Vol. 44 (2004), p.269.

[9] L. Rotherham, A. D. N. Smith and G. B. Greennough : J. Inst. Metal. Vol. 79 (1951), p.439.

[10] K. C. Norris and A.H. Lansberg: IBM Journal of Research and Development Vol. 13 (1969), p.226.

Fetching data from Crossref.
This may take some time to load.