Thermal Deformation Analysis of Copper Microbridges with Speckle Interferometry and Finite Element

Abstract:

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In this paper, a speckle microinterferometric system was employed to study the thermal deformation of the Cu microbridges with different dimensions. The deflections of the microbridges caused by the thermal loading were measured with real-time by the speckle microinterferometric system and the surface temperatures of the bridges were recorded using a digital thermometer. The deformation evaluation after microbridges buckling was also recorded with our testing system. Then, the experimental results were compared with the finite element analysis (FEA).

Info:

Periodical:

Key Engineering Materials (Volumes 353-358)

Edited by:

Yu Zhou, Shan-Tung Tu and Xishan Xie

Pages:

2871-2874

DOI:

10.4028/www.scientific.net/KEM.353-358.2871

Citation:

Z. Zhang et al., "Thermal Deformation Analysis of Copper Microbridges with Speckle Interferometry and Finite Element", Key Engineering Materials, Vols. 353-358, pp. 2871-2874, 2007

Online since:

September 2007

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Price:

$35.00

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