The Mechanisms Analysis of the ACF Bonding Strengths after the High Temperature/ Humidity Environment Test

Abstract:

The environmental experiments of the thermal cycling (-40~125°C) and the high temperature/humidity (85°C, 85%RH) aging were used to evaluate the reliability of the specimens bonded with ACFs. It was found that the high temperature/humidity was the harshest condition to the ACFs bonding. The DSC testing and interfacial stresses analysis has been done under the high temperature/humidity condition. The mechanisms of the bonding strength decrease were investigated.

• Periodical: Key Engineering Materials (Volumes 353-358)
• Pages: 2875-2878
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.353-358.2875
• Online since: September 2007
• Authors: Jun Zhang, Xu Chen, Xin Li Wei, Yong Cheng Lin
• Keywords: Anisotropic Conductive Adhesive Films (ACFs), Glass Transition Temperature, Interfacial Stresses Analysis

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