The Mechanisms Analysis of the ACF Bonding Strengths after the High Temperature/ Humidity Environment Test
The environmental experiments of the thermal cycling (-40~125°C) and the high temperature/humidity (85°C, 85%RH) aging were used to evaluate the reliability of the specimens bonded with ACFs. It was found that the high temperature/humidity was the harshest condition to the ACFs bonding. The DSC testing and interfacial stresses analysis has been done under the high temperature/humidity condition. The mechanisms of the bonding strength decrease were investigated.
Yu Zhou, Shan-Tung Tu and Xishan Xie
J. Zhang et al., "The Mechanisms Analysis of the ACF Bonding Strengths after the High Temperature/ Humidity Environment Test", Key Engineering Materials, Vols. 353-358, pp. 2875-2878, 2007