Preface
Mechanism of Brittle-Ductile Transition of Single Silicon Wafer at Different Temperatures
p.1
p.1
Mechanism of Material Removal and the Generation of Defects by MD Analysis in Three-Dimensional Simulation in Abrasive Processes
p.6
p.6
Study of the Wettability between Diamond Abrasive and Vitrified Bond with Low Melting Point and High Strength
p.11
p.11
Effect of Si and Ti Coating on Interface Bonding between Diamond and Fe-Based Metal Bond
p.15
p.15
Nanodiamond Modified with SHP
p.19
p.19
Study on Tribological Performance of Fine-Grained Diamond Films
p.23
p.23
The Experimental Study on Wear Performance of Brazed Diamond Grits
p.28
p.28
Grinding Titanium Alloy with Brazed Monolayer CBN Wheels
p.33
p.33
Preface
Abstract:
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Info:
Periodical:
Key Engineering Materials (Volumes 359-360)
Online since:
November 2007
Сopyright:
© 2008 Trans Tech Publications Ltd. All Rights Reserved
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