Study of the Wettability between Diamond Abrasive and Vitrified Bond with Low Melting Point and High Strength

Jian Bing Zang; Jing Lu; Yan Hui Wang; Xiang Hong Zhang; Yun Gang Yuan

doi:10.4028/www.scientific.net/KEM.359-360.11

Paper Titles

Mechanism of Brittle-Ductile Transition of Single Silicon Wafer at Different Temperatures
p.1

Mechanism of Material Removal and the Generation of Defects by MD Analysis in Three-Dimensional Simulation in Abrasive Processes
p.6

Study of the Wettability between Diamond Abrasive and Vitrified Bond with Low Melting Point and High Strength
p.11

Effect of Si and Ti Coating on Interface Bonding between Diamond and Fe-Based Metal Bond
p.15

Nanodiamond Modified with SHP
p.19

Study on Tribological Performance of Fine-Grained Diamond Films
p.23

The Experimental Study on Wear Performance of Brazed Diamond Grits
p.28

Grinding Titanium Alloy with Brazed Monolayer CBN Wheels
p.33

HomeKey Engineering MaterialsKey Engineering Materials Vols. 359-360Study of the Wettability between Diamond Abrasive...

Study of the Wettability between Diamond Abrasive and Vitrified Bond with Low Melting Point and High Strength

Abstract:

The adhesion between diamond grits and the bond strongly influence the properties of diamond tools. Since diamond is covalent crystal, the high interfacial energy leads to the poor interface bonding between diamond grits and the bond. Furthermore, the sintering temperature of traditional vitrified bond is also very high because of the high refractoriness of alkalis containing in the bond, resulting in serious thermal damage to diamond grits. In this paper, a low melting point and high strength vitrified bond has been prepared mainly from borate glass, clay and lead glass. The bond is completely glassy above 850°C and the bending strength of the bond sintered at 850°C for 7 minutes is 125.7MPa with a 6.5:3.5 corundum/bond ratio. Moreover, this bond possesses good wettability with diamond abrasive from 600°C to 850°C.

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Periodical:

Key Engineering Materials (Volumes 359-360)

Pages:

11-14

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.359-360.11

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Online since:

November 2007

Authors:

Jian Bing Zang, Jing Lu, Yan Hui Wang, Xiang Hong Zhang, Yun Gang Yuan

Keywords:

Diamond Tool, High-Strength, Low Melting Point, Vitrified Bond, Wettability

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