Research on the Hydrodynamic Electro-Chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid

Jian Ming Zhan; Di Zheng

doi:10.4028/www.scientific.net/KEM.359-360.290

Paper Titles

Research on Nanoscale Material Removal Process Using Atomic Force Microscopy
p.269

Experimental Study of Precision Polishing of Hard and Brittle Material
p.274

Influences of Machining Parameters on Silicon Wafer Polished with Gel-Coupled Ultra-Fine Abrasive Polishing Pads
p.279

Study on Mechanical Polishing for CVD Diamond Films of Forming Nucleus Surface and Growing Surface
p.285

Research on the Hydrodynamic Electro-Chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid
p.290

Study of Finishing Internal Surface Using Magnetic Force Generated by Rotating Magnetic Field in Electromotor
p.295

Experimental Study on Increasing Magnetic Abrasive Finishing Efficiency of Finishing Nonferromagnetic Materials
p.300

Optimize Parameters of Floating Polishing with Tri-Polishing-Disk
p.305

Study on Pad Conditioning Parameters in Silicon Wafer CMP Process
p.309

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Research on the Hydrodynamic Electro-Chemical Mechanical Polishing for Silicon Wafer with Suspension Fluid

Abstract:

Silicon wafer is one of the key materials of LSI and SLSI and has been widely used in the electronic industries and IT products. In the new century of nano times, silicon wafer needs higher geometry accuracy, lower surface roughness and higher precision machining effecency, but no disfigurement in its surface layer. Nowadays, non-contact polishing still seems to be most efficient method to achieve nano-scale geometry accuracy and maintain surface roughness in the nanometer level even for silicon wafer, but it is still not easier to control its machining course and to obtain well-pleasing machining effecency. In this paper, a hydrodynamic electro-chemical polishing system based on CNC is established with micro-displacement compensating for nano-scale polishing. A new type of compliant polishing tool system is developed, which can turn orthogonal force control subspace and position control subspace to isomorphic position servo space. Moreover, it convert force control deflection to position servo deflection and in this way the polishing force is controlled by micro-displacement compensating with piezoelectricity. Polishing experiments on silicon wafer, in hydrodynamic polishing fluid mixed with nano-scale SiO2 abrasive particles, have been conducted to investigate the fundamental machining mechanism.