The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field

Abstract:

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The growth behaviors of intermetallic compound (IMC) layers in soldered and diffusion bonding Sn/Cu joints and the effects of magnetic field have been investigated. The results indicate that, without high magnetic field, the growth behaviors of these two IMC layers are similar in the aging except the initial morphologies. However, the morphologies and crystal orientations of these two IMC layers have changed after being aged in high magnetic field.

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Periodical:

Key Engineering Materials (Volumes 373-374)

Main Theme:

Edited by:

M.K. Lei, X.P. Zhu, K.W. Xu and B.S. Xu

Pages:

480-483

DOI:

10.4028/www.scientific.net/KEM.373-374.480

Citation:

C. Q. Cheng et al., "The Growth Behaviors of IMC Layers at Soldered and Diffusion Bonding Sn/Cu Interfaces and the Effects of High Magnetic Field", Key Engineering Materials, Vols. 373-374, pp. 480-483, 2008

Online since:

March 2008

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Price:

$35.00

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