Comparison of Processing Features between Semi Bonded Abrasive Lapping and Loose Abrasive Lapping

Abstract:

Semi bonded abrasive lapping is an effective ultra-precision lapping method. It can obtain good surface quality of workpiece in short time. This paper focused on the differences of processing features by comparing semi bonded abrasive lapping and loose abrasive lapping in several groups processing parameters. The results showed that the surface roughness of workpiece in semi bonded abrasive lapping was far superior to that of loose abrasive lapping in same processing parameters. And the MRR (material removal rate) of semi bonded abrasive lapping was slightly lower than that of loose abrasive lapping. For these features of semi bonded abrasive, a new processing flow would also be proposed in this paper.

• Periodical: Key Engineering Materials (Volume 416)
• Pages: 439-442
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.416.439
• Online since: September 2009
• Authors: Xun Lv, Ju Long Yuan, Dong Hui Wen
• Keywords: Loose Abrasive Lapping, Processing Features, Semi Bonded Abrasive Lapping

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