Improvement of Corrosion Behavior of the Cu-Ni Alloy with Electroless Ni-P Plating

Qing Fen Li; Yu Dong Fu; Hai Dou Wang; Jun Wang

doi:10.4028/www.scientific.net/KEM.417-418.29

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 417-418Improvement of Corrosion Behavior of the Cu-Ni...

Improvement of Corrosion Behavior of the Cu-Ni Alloy with Electroless Ni-P Plating

Abstract:

The microbiological influenced corrosion (MIC) behavior of the Cu-Ni alloy with or without Ni-P plating in the sterilized medium and sulfate-reducing bacteria (SRB) solution was investigated. Results show that severe pitting corrosion appeared on the uncoated specimens in both the sterilized medium and the SRB solution when the specimens coated with Ni-P plating were still in good condition. Since the Ni-P plating may offer both barrier and cathodic protection to the base metal. Besides, the structures of Ni-P plating and the passive film on the surface of the Ni-P plating are high uniform and amorphous without any structure defects. The non-crystalline structure may improve the corrosion resistance because it does not have crystalline defects such as dislocation, grain boundary, twin and so on which may cause corrosion easily. It is concluded that corrosion behavior of the Cu-Ni alloy with electroless Ni-P plating was improved greatly.

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Periodical:

Key Engineering Materials (Volumes 417-418)

Pages:

29-32

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.417-418.29

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Online since:

October 2009

Authors:

Qing Fen Li, Yu Dong Fu, Hai Dou Wang, Jun Wang

Keywords:

Cu-Ni Alloy, Electroless Ni-P Plating, Microbiological Influenced Corrosion (MIC), Sulfate-Reducing Bacteria (SRB)

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References

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