Dynamic Anti-Plane Characteristic of Two Dissimilar Piezoelectric Media with an Interfacial Crack

Tian Shu Song; Dong Li; Tammam Merhej

doi:10.4028/www.scientific.net/KEM.417-418.869

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HomeKey Engineering MaterialsKey Engineering Materials Vols. 417-418Dynamic Anti-Plane Characteristic of Two...

Dynamic Anti-Plane Characteristic of Two Dissimilar Piezoelectric Media with an Interfacial Crack

Abstract:

Dynamic anti-plane characteristic is investigated theoretically on two dissimilar piezoelectric media with an interfacial crack subjected to time-harmonic incident anti-plane shearing in this paper. The formulations are based on the method of complex variable and Green’s function. Dynamic stress intensity factors at the crack’s tip are obtained by solving boundary value problems with the methods of conjunction and crack-division technique. The calculating results are plotted to show how the frequencies of incident wave, all kinds physical parameters of two dissimilar piezoelectric materials, applied electric loads and the dimension of the interfacial crack influence upon the dynamic stress intensity factor (DSIF). And some of the calculating results are compared with other published documents.

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Periodical:

Key Engineering Materials (Volumes 417-418)

Pages:

869-872

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.417-418.869

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Online since:

October 2009

Authors:

Tian Shu Song, Dong Li, Tammam Merhej

Keywords:

Dynamic Stress Intensity Factor (DSIF), Green's Function, Interfacial Crack, Two Dissimilar Piezoelectric Media

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References

[1] X.D. Wang, S.A. Meguid: Modeling and analysis of a cavity or a crack in a piezoelectric material. Int. J. Solids Structures, 38, 2803-2820 (2001).

Google Scholar

[2] X. Wang, S. Yu: Scattering of SH waves by an arc-shaped crack between a cylindrical piezoelectric inclusion and matrix-II: Far fields. Int. J. Fracture, 100(4), 35-40 (1999).

DOI: 10.4028/www.scientific.net/kem.251-252.215

Google Scholar

[3] S. A, Meguid, X.D. Wang: Dynamic anti-plane behavior of interacting cracks in a piezoelectric medium. Int. J. Fracture, 91, 391-403 (1998).

Google Scholar

[4] Z.T. Chen M.J. Worswick: Dynamic fracture behavior of a cracked piezoelectric half space under anti-plane mechanical and in-plane electric impact. Archive of Applied Mechanics, 1-12 (2002).

DOI: 10.1007/s004190000123

Google Scholar

[5] J.F. Loeber, G.C. Sih: Diffraction of anti-plane shear waves by a finite crack. J. Acoustical Society of America, 44(1): 90-98 (1968).

DOI: 10.1121/1.1911091

Google Scholar

[6] C.T. Albert, S. F Li and S.D. Glaser: Propagation of a mode-III interfacial conductive crack along a conductive interface between two piezoelectric materials. Wave Motion, 43：368-386 (2006).

DOI: 10.1016/j.wavemoti.2006.02.001

Google Scholar