Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

Li Gang Zhao; Dun Wen Zuo; Yu Li Sun; Min Wang

doi:10.4028/www.scientific.net/KEM.431-432.25

Paper Titles

Study on Mixed Assembly Modeling of Rigid and Flexible Parts for Aerospace Product Virtual Assembly
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Numerical Simulation of the Prestressed Laser Welding of 7075－T7451 Aluminum Alloy Sheet
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Preparation and Evaluation of Hydrophilic Fixed Abrasive Pad
p.17

Simulation of Gas Flow Field in HFCVD System for CVD Diamond Growth
p.21

Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw
p.25

Fatigue Life Simulation on Forestay Bar of Aircraft Landing Gear
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Effect of Anisotropy on Chemical Mechanical Polishing of LBO Crystal
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Research on High-Speed Preparation of Micro-Nanocrystalline Diamond Film
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Rapid Parameter Optimization of High Speed Milling Aluminum Alloy Thin-Walled Workpiece
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HomeKey Engineering MaterialsKey Engineering Materials Vols. 431-432Experimental Research on Cutting of Silicon with...

Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

Abstract:

The experimental research on silicon was reported in this paper. The surface roughness under the different workpiece feed speed and linear velocity of the wire saws is studied mainly in this experiment. The effects of the workpiece feed Vs and the linear velocity of the wire saws Vw were analyzed.

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Key Engineering Materials (Volumes 431-432)

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25-28

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https://doi.org/10.4028/www.scientific.net/KEM.431-432.25

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Online since:

March 2010

Authors:

Li Gang Zhao, Dun Wen Zuo, Yu Li Sun, Min Wang

Keywords:

Fixed Diamond Wire Saw, Silicon Wafer

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References

[1] A. Jakubowski, L. Lukasial and M. Jurczak: Siliconmicroe-lectronics for Speed. In: Kumar V. Agarmal S K ed. Phys. of semicon, devices299. vl. USA. Allied pub. L td., 2000, pp.297-302.

Google Scholar

[2] M.A. Chun: Development Trend of Semiconducting Silicon Materials of the World. Shanghai Nonferrous Metals, Vol. 26 (3) (2005), pp.145-148.

Google Scholar

[3] World Manufacturing Engineering & Market, 2004. 5, p.36.

Google Scholar

[4] P.Q. Ge, J.F. Meng, J.H. Chen and et al.: Precision Slicing Technology for Single Crystal Silicon and Relative Basic Research. Tool Engineering, 2005 . 39, pp.3-6.

Google Scholar

[5] L.G. Zhao, D. W Zuo. and et al.: Key Engineering Materials, Vol. 315-316 (2006), pp.215-219.

Google Scholar

[6] L.G. Zhao, D.W. Zuo and et al.: Key Engineering Materials, Vol. 375-376 (2008), pp.1-5.

Google Scholar

[7] L.G. Zhao., D.W. Zuo and et al.: Key Engineering Materials, Vol. 407-408 (2009), pp.684-689.

Google Scholar

[8] B.C. Chong: The Effect of ID Slice Machine for Cutting. Equipment For Electronic Products Manufacturing, Vol. 31 (3) 2002, pp.156-158.

Google Scholar

[9] R.X. Fan and H.M. Hu: Materials Science and Engineering, Vol. 17 (2) (1999), pp.55-57.

Google Scholar

[10] R.K. Kang, Y.B. Tian, D.M. Guo and et al.: Diamond & Abrasives Engineering, 2003 (4), pp.13-18.

Google Scholar

[11] I. Kao, V. Prasad, J. Li and et al.: Wafer Slicing and Wire Saw Manufacturing Technology. The NSF Grantees Conference (1997).

Google Scholar

[12] I. Kao, M. Bhagavat, V. Prasad and et al.: Integrated Modeling of Wire Saw in Wafer Slicing. The NSF Grantees Conference (1998).

Google Scholar

[13] W.I. Clark, A.J. Shih, C.W. Hardin and et al.: International Journal Machine Tools &Manufacture, 2003, 43, pp.523-532.

Google Scholar

[14] M.R. Chang: Semiconductor Technology, Vol. 31 (6) (2006), pp.176-179.

Google Scholar