Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw

Abstract:

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The experimental research on silicon was reported in this paper. The surface roughness under the different workpiece feed speed and linear velocity of the wire saws is studied mainly in this experiment. The effects of the workpiece feed Vs and the linear velocity of the wire saws Vw were analyzed.

Info:

Periodical:

Key Engineering Materials (Volumes 431-432)

Edited by:

Yingxue Yao, Dunwen Zuo and Xipeng Xu

Pages:

25-28

DOI:

10.4028/www.scientific.net/KEM.431-432.25

Citation:

L. G. Zhao et al., "Experimental Research on Cutting of Silicon with Fixed Diamond Wire Saw", Key Engineering Materials, Vols. 431-432, pp. 25-28, 2010

Online since:

March 2010

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Price:

$35.00

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