Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal
Abstract. The reaction layer microstructure of SiC/SiC joints brazed by Ag-Cu-Ti filler metal, including composition, morphology, grain size were investigated by X-ray diffraction, electronic probe microanalysis, transmission electron microscope. An obvious reaction layer composed of TiC and Ti5Si3 was observed at the interface of SiC substrate and filler metal. There is a representative structure of SiC substrate/continuous fine TiC layer /discontinuous coarse Ti5Si3 layer/filler metal in the reaction layer. The continuous TiC layer, composed of about 10 nm roundish grains, is 350 ~ 400 nm thick. Ti5Si3 layer is composed of only one row of Ti5Si3 grains, which disperse with diverse size from 100 ~ 500 nm. Different growth behavior of TiC and Ti5Si3 is the main reason to form this microstructure.
Wei Pan and Jianghong Gong
Y. Liu et al., "Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal", Key Engineering Materials, Vols. 434-435, pp. 202-204, 2010