Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal

Abstract:

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Abstract. The reaction layer microstructure of SiC/SiC joints brazed by Ag-Cu-Ti filler metal, including composition, morphology, grain size were investigated by X-ray diffraction, electronic probe microanalysis, transmission electron microscope. An obvious reaction layer composed of TiC and Ti5Si3 was observed at the interface of SiC substrate and filler metal. There is a representative structure of SiC substrate/continuous fine TiC layer /discontinuous coarse Ti5Si3 layer/filler metal in the reaction layer. The continuous TiC layer, composed of about 10 nm roundish grains, is 350 ~ 400 nm thick. Ti5Si3 layer is composed of only one row of Ti5Si3 grains, which disperse with diverse size from 100 ~ 500 nm. Different growth behavior of TiC and Ti5Si3 is the main reason to form this microstructure.

Info:

Periodical:

Key Engineering Materials (Volumes 434-435)

Edited by:

Wei Pan and Jianghong Gong

Pages:

202-204

DOI:

10.4028/www.scientific.net/KEM.434-435.202

Citation:

Y. Liu et al., "Reaction Layer Microstructure of SiC/SiC Joints Brazed by Ag-Cu-Ti Filler Metal", Key Engineering Materials, Vols. 434-435, pp. 202-204, 2010

Online since:

March 2010

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Price:

$35.00

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