Dielectric Properties of HfO2 Films Prepared on Flexible Polymer Substrates Using UV Irradiation

Abstract:

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The HfO2 films were prepared on the ITO/polyimide substrate using alkoxy-derived precursor solutions at low temperature. The HfO2 films prepared by UV-assisted process using the precursor solution modified with diethanolamine had smooth surface and RMS roughness values of HfO2 film were 1.2nm. The electrical properties of HfO2 films were improved by optimization of preparation condition. The leakage current density at 1V was below 10-5A/cm2. The dielectric constant was about 20. The loss tangent was below 0.1.

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Periodical:

Edited by:

Shinobu Fujihara and Tadashi Takenaka

Pages:

164-167

DOI:

10.4028/www.scientific.net/KEM.445.164

Citation:

K. Suzuki and K. Kato, "Dielectric Properties of HfO2 Films Prepared on Flexible Polymer Substrates Using UV Irradiation", Key Engineering Materials, Vol. 445, pp. 164-167, 2010

Online since:

July 2010

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$35.00

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