The Effect of the Cure Temperature on the Thermomechanical Characteristics of an Adhesive

Abstract:

Article Preview

The origin of this work takes place in the framework of an industrial collaboration in order to study the behavior of a mechanical joint, used in the industry of railway structures. One problem in using the structural adhesive in the industry is hygrothermal ageing. In these papers; the effect of the adhesive cure temperature on the mechanical properties of a commercial bi-component epoxy bonding joint will be studied. Usually the bi-component epoxy is cured at room temperature. The industrial goal in this study is to increase the mechanical performances of adhesively bonded structures. To achieve this goal the curing process of the adhesive will be optimized.

Info:

Periodical:

Edited by:

Moussa Karama

Pages:

43-49

DOI:

10.4028/www.scientific.net/KEM.446.43

Citation:

M. Ali et al., "The Effect of the Cure Temperature on the Thermomechanical Characteristics of an Adhesive", Key Engineering Materials, Vol. 446, pp. 43-49, 2010

Online since:

July 2010

Export:

Price:

$35.00

In order to see related information, you need to Login.

In order to see related information, you need to Login.