The Effect of the Cure Temperature on the Thermomechanical Characteristics of an Adhesive

Mohamad Ali; Bernard Lorrain; Moussa Karama; Bernard PUEL

doi:10.4028/www.scientific.net/KEM.446.43

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Physicochemical and Electro-Rheological Characterization of Kaolinite / CMS / Silicone Oil Fluid
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 446The Effect of the Cure Temperature on the...

The Effect of the Cure Temperature on the Thermomechanical Characteristics of an Adhesive

Abstract:

The origin of this work takes place in the framework of an industrial collaboration in order to study the behavior of a mechanical joint, used in the industry of railway structures. One problem in using the structural adhesive in the industry is hygrothermal ageing. In these papers; the effect of the adhesive cure temperature on the mechanical properties of a commercial bi-component epoxy bonding joint will be studied. Usually the bi-component epoxy is cured at room temperature. The industrial goal in this study is to increase the mechanical performances of adhesively bonded structures. To achieve this goal the curing process of the adhesive will be optimized.

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Periodical:

Key Engineering Materials (Volume 446)

Pages:

43-49

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.446.43

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Online since:

July 2010

Authors:

Mohamad Ali, Bernard Lorrain, Moussa Karama, Bernard PUEL

Keywords:

Adhesive Failure, Adhesive Joint, Cohesive Failure, Differential Scanning Calorimetry (DSC), Hydrothermal Ageing, Optimization of Polymerization, Thermomechanical Behaviour

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References

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