Cracking of NiTi Thin Films Deposited on Cu Substrate

Yong Hua Li; F.L. Meng; Wei Tao Zheng; Y.M. Wang

doi:10.4028/www.scientific.net/KEM.462-463.716

Paper Titles

Effect of Plasma Spray Variables on Cu-Ni Coated A7075
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Failure of Composites with Discontinuous Fabric Preform under Bending
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Numerical Simulation and Experimentation of Warm Metal Powder Compaction Process
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Phase Field Simulation of Ferroelectrics with Cracks
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Cracking of NiTi Thin Films Deposited on Cu Substrate
p.716

Dynamic Response of Metallic Square Honeycomb Sandwich Plate Subjected to Blast Loading
p.720

Mechanics of Composite Delamination under Flexural Loading
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Research of Surface Deformation with Metro Double Tunnels Construction and the Relative Position Change
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Effect of Sandblasting and Surface Mechanical Attrition Treatment on Surface Roughness, Wettability, and Microhardness Distribution of AISI 316L
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Cracking of NiTi Thin Films Deposited on Cu Substrate

Abstract:

This study has investigated the cracking of Ti-51.45at.%Ni thin films deposited on Cu substrate. An analysis is presented that relates the crack spacing and the Vickers microhardness values to the strain in the film. Tensile tests are carried out on CSS-44100 electron universal testing machine. The strain rate is 1.1 × 10-4 s-1. The average crack spacing is obtained using scanning electron microscopy (SEM). The Vickers microhardness values are determined by Everone MH-6 microhardness tests. The results have showed that a series of parallel cracks grew in the film and the cracks are equally spaced. The minimum crack spacing is about 87 μm. The mean crack spacing is dependent on the tensile strain in the film. The crack spacing decreases as the film elongation increases. The Vickers microhardness values increase as the film elongation increases.