Microstructure, Thermal and Electrical Properties of Ultrafine Aluminium

Abstract:

In article the influence of large effective deformation on microstructure, thermal diffusivity and electrical conductivity is described. The tested material was monocrystalline aluminum deformed by the cyclic extrusion compression (CEC) method. The evolution of misorientation distribution, sub(grain) size was determined by using electron back scattered diffraction (EBSD) technique. The second part of the study was to evaluation of thermal diffusivity by using the laser-flash method. The LFA 427 laser-flash facility were applied. The electrical properties as electrical impedance was made by impedance bridge RLC type. The obtained results show that with increase of deformation the insignificant decrease in thermal diffusivity and electrical conductivity occurred.

• Periodical: Key Engineering Materials (Volume 465)
• Pages: 326-329
• DOI: https://doi.org/10.4028/www.scientific.net/KEM.465.326
• Online since: January 2011
• Authors: Kinga Rodak, Grzegorz Moskal, Andrzej Grabowski
• Keywords: Electron Backscatter Diffraction (EBSD), Physical Properties, Severe Plastic Deformation (SPD), TEM, Ultrafine Grained Structure

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