Study on Anodic Bonding Process of Slender Vitreous Body

Ming Qiang Pan; Li Guo Chen; Tao Chen; Zhen Hua Wang; Li Ning Sun

doi:10.4028/www.scientific.net/KEM.503.435

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HomeKey Engineering MaterialsKey Engineering Materials Vol. 503Study on Anodic Bonding Process of Slender...

Study on Anodic Bonding Process of Slender Vitreous Body

Abstract:

With the development of MEMS technology, the pressure sensors, one of mature MEMS devices, are expected to better performance. In order to improve sensors performance, supporting vitreous body shape is elongated and thinned. But the variety of the vitreous body shape brings the new difficulties for anodic bonding between the vitreous body and the silicon during the sensors production, and causes that the common bonding process conditions are unavailable and bonding failure rate dramatically increases. Therefore, this article analyzes the bonding process between slender vitreous body and silicon, and researches on the influence of the vitreous body variety on the pressure, temperature and voltage. The results showed that the bonding is the best when the cantilever elastic deformation is less than 0.5mm, interface temperature loaded from the silicon is 415°C and the voltage 1200V is loaded from the position near H=2mm.

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Periodical:

Key Engineering Materials (Volume 503)

Pages:

435-439

DOI:

https://doi.org/10.4028/www.scientific.net/KEM.503.435

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Online since:

February 2012

Authors:

Ming Qiang Pan, Li Guo Chen, Tao Chen, Zhen Hua Wang, Li Ning Sun

Keywords:

Anodic Bonding, Bonding Process, Slender Vitreous Body

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