Study on Microstructure and Property of Diffusion-Bonded Mo-Cu Joints

Jian Zhang; Guo Qiang Luo; Mei Juan Li; Qiang Shen; Lian Meng Zhang

doi:10.4028/www.scientific.net/KEM.508.178

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Study on Microstructure and Property of Diffusion-Bonded Mo-Cu Joints
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HomeKey Engineering MaterialsKey Engineering Materials Vol. 508Study on Microstructure and Property of...

Study on Microstructure and Property of Diffusion-Bonded Mo-Cu Joints

Abstract:

Mo and Cu Were Bonded Successfully by Means of Vacuum Diffusion Bonding. The Interfacial Structure of the Joints Was Studied by Scanning Electron Microscopy (SEM), Electron Probe Microanalysis (EPMA), Energy Dispersive X-Ray Spectrometer (EDS) and X-Ray Diffraction (XRD), the Mechanical Property Is Tested by Tensile Strength Measurement. The Results Showed that the Differentatoms Diffused to each other in the Bonding Process. A Mo-Cu Solid Solution Was Formed in the Joint and with No Intermetallic Compounds. The Tensile Strength of the Joint Increased with the Increasing of Temperature, however, while the Holding Time Increased, the Strength Increased in the First Stages and then Decreases. It Were Observed that the Fracture Mode of the Joints Was a Brittle Fracture.

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Key Engineering Materials (Volume 508)

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178-182

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https://doi.org/10.4028/www.scientific.net/KEM.508.178

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Online since:

March 2012

Authors:

Jian Zhang, Guo Qiang Luo, Mei Juan Li, Qiang Shen, Lian Meng Zhang

Keywords:

Diffusion, Interface, Microstructure, Mo-Cu

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